- All sections
- H - Electricity
- H01R - Electrically-conductive connections; structural associations of a plurality of mutually-insulated electrical connecting elements; coupling devices; current collectors
- H01R 13/41 - Securing in non-demountable manner, e.g. moulding, riveting by frictional grip in grommet, panel or base
Patent holdings for IPC class H01R 13/41
Total number of patents in this class: 420
10-year publication summary
|
33
|
31
|
28
|
59
|
65
|
57
|
43
|
26
|
21
|
4
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Sumitomo Wiring Systems, Ltd. | 9367 |
29 |
| Foxconn Interconnect Technology Limited | 1034 |
29 |
| Yazaki Corporation | 6282 |
27 |
| Japan Aviation Electronics Industry, Limited | 1585 |
23 |
| Molex, LLC | 1792 |
23 |
| Lotes Co., Ltd. | 346 |
21 |
| Foxconn (Kunshan) Computer Connector Co., Ltd. | 286 |
12 |
| TE Connectivity Germany GmbH | 655 |
8 |
| TE Connectivity Solutions GmbH | 2580 |
8 |
| Sumitomo Electric Industries, Ltd. | 14131 |
7 |
| Robert Bosch GmbH | 40953 |
7 |
| Tyco Electronics Japan G.K. | 382 |
7 |
| Kyocera Corporation | 12735 |
6 |
| AutoNetworks Technologies, Ltd. | 5809 |
6 |
| Iriso Electronics Co., Ltd. | 184 |
6 |
| Phoenix Contact GmbH & Co. KG | 2202 |
6 |
| Samtec, Inc. | 455 |
6 |
| Conti Temic microelectronic GmbH | 951 |
5 |
| Tyco Electronics (shanghai) Co. Ltd. | 759 |
5 |
| FCI USA LLC | 200 |
5 |
| Other owners | 174 |